Ukwazisa ngeeMbonelelo zaMandla kwi-ICT Industry PSiP

I-PSiP (Ubonelelo lwaMandla kwiPakethi) unikezelo lwamandla ebhodini: Ukusebenzisa itekhnoloji yokupakisha ye-semiconductor ukwenza i-high-density high-density PSiP package power supply

Ngokuphindaphindwa kokusetyenziswa kwamandla kwezixhobo, ukuchasana phakathi kwamandla kunye nomthamo kuya kusiba ngakumbi nangakumbi.
Ukusasazwa okubukhoma, ividiyo, imidlalo kunye namanye amashishini anamandla ekhompyuter aphezulu ukukhuthaza uphuhliso ukusuka kwi-CPU ukuya kwi-CPU + XPU, ukusetyenziswa kwamandla e-chip kwandiswe ngaphezu kwe-50%, ukusetyenziswa kwamandla omncedisi we-server yonke kwanda kakhulu i-motherboard ye-server.

Ubonelelo lwaMandla eBhodi.
Umthamo we-motherboard awunyuki.
Amandla ombane aphindwe kabini, umthamo woxinaniso lwamandla afanayo lonyuke ngama-80%.

Ukupakishwa kwe-PCB edityaniswe kakhulu kunye neteknoloji yokusetyenzwa komphezulu, ibhodi yonikezelo lwamandla ombane yonyuka nge-70%

PSiP series unikezelo lwamandla: 10 ~ 100W

Uyilo oludityanisiweyo lweSemiconductor y iinzuzo zokunciphisa izinga lokungaphumeleli:
- Ifilosofi yoyilo lweSemiconductor / ukuhamba / unikezelo lwamandla loyilo oluqhelekileyo
- Ithembeke kakhulu, uthuli, ukufuma kunye netyuwa yokutshiza iyaxhathisa
-Imveliso ezenzekelayo ngokupheleleyo kunye ne-99.9% + ngqo kwireyithi